Method for manufacturing a submillimetric electrically conductive grid coated with an overgrid
US8808790B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2009 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Jul 5, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of manufacturing a submillimetric electroconductive grid coated with an overgrid on a substrate includes: the production of a mask having submillimetric openings by the deposition of a solution of colloidal polymeric nanoparticles that are stabilized and dispersed in a solvent, the polymeric particles having a glass transition temperature Tg and the drying of the masking layer at a temperature below the Tg until the mask, with straight edges, is obtained, the formation of the electroconductive grid by a deposition of electroconductive material, referred to as grid material, a heat treatment of the masking layer with the grid material at a temperature greater than or equal to 0.8 times Tg, thus creating a space between the edges of mask zones and the lateral edges of the grid; a deposition of a layer, referred to as an overlayer, made of a material referred to as overlayer material, on the grid and in the space between the edges of mask zones and the lateral edges of the grid; a removal of the masking layer. The invention also relates to the grid thus obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.