Patent · US Active

Germanium-containing solder, a component comprising a solder and a process for soldering

US8808872B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Michael Ott · Wetter (Ruhr), DE
Sebastian Piegert · Berlin, DE
Peter Randelzhofer · Erlangen, DE
Robert Singer · Erlangen, DE

Key dates

Filing date	Apr 6, 2011
Grant date	Aug 19, 2014
Priority date	—
Expiry date	Apr 6, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12944
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A germanium containing nickel-based solder having a similar composition to a nickel-based superalloy is provided. As a result of which the proportion of γ′ formed in the solder is reduced. The solder also includes chromium, cobalt, molybdenum, tungsten, aluminum, and titanium. A component including the solder is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.