Method of processing a semiconductor assembly
US8809105B2 · kind B2 · utility
1Cited by
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20Claims
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Key dates
| Filing date | Jun 14, 2012 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Jun 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for processing a semiconductor assembly is presented. The method includes thermally processing a semiconductor assembly in a non-oxidizing atmosphere at a pressure greater than about 10 Torr. The semiconductor assembly includes a semiconductor layer disposed on a support, and the semiconductor layer includes cadmium and sulfur.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.