Polyamic acid solution, polyimide resin and flexible metal clad laminate using the same
US8809688B2 · kind B2 · utility
1Cited by
12References
14Claims
0Family size
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Key dates
| Filing date | Apr 2, 2010 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Feb 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are a polyamic acid solution, a polyimide resin prepared by imidization of the polyamic acid solution, a flexible metal clad laminate using the polyimide resin, and a printed circuit board including the flexible metal clad laminate, wherein the polyamic acid solution includes (a) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (BPDA), and pyromellitic dianhydride (PMDA) as aromatic tetracarboxylic acid dianhydride; (b) at least one aromatic diamine; (c) an organic solvent; and (d) an inorganic filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.