Integrated power converter package with die stacking
US8810013B2 · kind B2 · utility
2Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2013 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | May 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit for implementing a switch-mode power converter is disclosed. The integrated circuit comprises at least a first semiconductor die having an electrically quiet surface, a second semiconductor die for controlling the operation of said first semiconductor die stacked on said first semiconductor die having said electrically quiet surface and a lead frame structure for supporting said first semiconductor die and electrically coupling said first and second semiconductor dies to external circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.