Piezoelectric devices and methods for manufacturing piezoelectric substrates used in such devices
US8810112B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 14, 2011 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Jun 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1035
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In a piezoelectric device, a piezoelectric substrate includes a vibrating piece with respective excitation electrodes on each principal surface thereof. The piezoelectric substrate is surrounded by an outer frame separated therefrom by a through-void except for a supporting portion connecting the vibrating piece to the frame. Extraction electrodes extend from the excitation electrodes across the supporting portion to the frame, and on edge surfaces of the supporting portion. The piezoelectric substrate is sandwiched between a lid and a package base to form a piezoelectric device. The outer surface of the package base is a mounting surface to which the extraction electrodes extend via an edge surface of the through-void in a region that does not overlap the excitation electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.