Thermal inspection and machining systems and methods of use
US8810644B2 · kind B2 · utility
7Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2010 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Jan 28, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2260/80
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present application provides a thermal imaging and machining system for a machine component. The thermal imaging and machining system may include a machining subsystem with a machining device for drilling one or more holes in the machine component and a thermal inspection subsystem positioned about the machining subsystem. The thermal inspection subsystem may include an imager and one or more fluid supply lines such that a thermal response of the holes in the machine component may be determined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.