Enhanced vbasis laser diode package
US8811445B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2010 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Jun 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4043
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A substrate having an upper surface and a lower surface is provided. The substrate includes a plurality of v-grooves formed in the upper surface. Each v-groove includes a first side and a second side perpendicular to the first side. A laser diode bar assembly is disposed within each of the v-grooves and attached to the first side. The laser diode bar assembly includes a first adhesion layer disposed on the first side of the v-groove, a metal plate attached to the first adhesion layer, a second adhesion layer disposed over the metal plate, and a laser diode bar attached to the second adhesion layer. The laser diode bar has a coefficient of thermal expansion (CTE) substantially similar to that of the metal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.