DC-DC converter semiconductor die structure
US8811920B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2011 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Jan 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2203/21157
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A direct current (DC)-DC converter having a DC-DC converter semiconductor die and an alpha flying capacitive element is disclosed. The DC-DC converter semiconductor die includes a first series alpha switching element, a second series alpha switching element, a first alpha flying capacitor connection node, which is about over the second series alpha switching element, and a second alpha flying capacitor connection node, which is about over the first series alpha switching element. The alpha flying capacitive element is electrically coupled between the first alpha flying capacitor connection node and the second alpha flying capacitor connection node. By locating the first alpha flying capacitor connection node and the second alpha flying capacitor connection node about over the second series alpha switching element and the first series alpha switching element, respectively, lengths of transient current paths may be minimized, thereby reducing noise and potential interference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.