Solder ball pattern forming
US8813350B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2011 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Jun 3, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53535
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array presentment apparatus and associated method are provided. The apparatus has a stationary guard defining a first passage. A core is mounted adjacent to the stationary guard, the core being operably moveable between an unload position and a second position. The core defines a second passage and supports a workpiece fixture operably retaining the ball grid array. The unload position of the core operably aligns the second passage to the first passage, the aligned passages being sized to permit access to unload the ball grid array from the workpiece fixture. The second position of the core operably misaligns the second passage from the first passage whereat the core and the stationary guard cooperatively form an enclosure around the workpiece fixture containing a supply of balls that are not retained in the ball grid array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.