Method of manufacturing an electromagnetic shielding structure
US8813354B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Aug 1, 2011 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Aug 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electromagnetic interference (EMI) shielding structure, which includes: a substrate, at least one chip unit, a packing layer, and an EMI shielding unit. The chip unit is disposed on the surface of the substrate and electrically coupled thereto. The packing layer is formed on the substrate and covers the chip unit. The EMI shielding unit includes: a first, second, and third shielding layer. The first shielding layer covers the outer surface of the packing layer and the lateral surface of the substrate. The second and third shielding layer respectively covers the outer surface of the first and second shielding layer. Based on the instant disclosure, the EMI shielding unit uses the methods of sputtering and electroless plating, to increase the adhesion strength of the EMI shielding unit and make the thickness of the shielding layer uniform. The instant disclosure raises the EMI shielding efficiency and lowers the manufacturing cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.