Piezoelectric inkjet printhead and method of manufacturing the same
US8813363B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2010 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Apr 2, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a piezoelectric inkjet printhead includes processing a lower silicon-on-insulator substrate having a sequentially stacked structure with a first silicon layer, an intervening oxide layer, and a second silicon layer, processing the lower silicon-on-insulator substrate by etching the second silicon layer to form a manifold, a plurality of pressure chambers arranged along at least one side of the manifold and connected with the manifold, and a plurality of dampers connected with the pressure chambers, and by etching the first silicon layer and the intervening oxide layer to form a plurality of vertical nozzles through the first silicon layer and the intervening oxide layer to corresponding ones of the plurality of dampers, stacking and bonding an upper substrate on the lower substrate, reducing the upper substrate to a predetermined thickness, and forming a piezoelectric actuator on the upper substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.