Micromechanical component and production method for a micromechanical component
US8813573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2010 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Apr 19, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A micromechanical component includes: an adjustable element connected to a holder at least via a spring; a first sensor device with at least one first piezo-resistive sensor element, which first sensor device provides a first sensor signal relating to a first mechanical stress, the first piezo-resistive sensor element being situated on or in an anchoring region of the spring; and a second sensor device with at least one second piezo-resistive sensor element, which second sensor device provides a second sensor signal relating to a second mechanical stress, the second piezo-resistive sensor element being situated on or in an anchoring region of the spring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.