Patent · US Active

Micromechanical component and production method for a micromechanical component

US8813573B2 · kind B2 · utility

0Cited by
4References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 18, 2010
Grant dateAug 26, 2014
Priority date
Expiry dateApr 19, 2031

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/42
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A micromechanical component includes: an adjustable element connected to a holder at least via a spring; a first sensor device with at least one first piezo-resistive sensor element, which first sensor device provides a first sensor signal relating to a first mechanical stress, the first piezo-resistive sensor element being situated on or in an anchoring region of the spring; and a second sensor device with at least one second piezo-resistive sensor element, which second sensor device provides a second sensor signal relating to a second mechanical stress, the second piezo-resistive sensor element being situated on or in an anchoring region of the spring.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.