Low friction shipping platform

US8813658B2 · kind B2 · utility

Assignee

• CHEP Technology Pty Limited · AU

Inventors

• John Thomas Storteboom · Roswell, US
• Oivind Brockmeier · Somerville, US
• Brandon Michael D'Emidio · Orlando, US
• Timothy R. Proulx · Nashua, US
• Gregory S. Burkett · Cambridge, US
• Jeffrey Ryan Chapin · Cambridge, US
• Kenneth Brandt · Bedugul, ID

Key dates

• Filing date: Dec 15, 2012
• Grant date: Aug 26, 2014
• Expiry date: Dec 15, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49947
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

A system may include a bottom deck to a shipping platform. The system may also include a component affixed to the bottom member opposite the shipping platform's top to lower static coefficient of friction between the component and a floor the shipping platform in its load bearing usage position is resting on.