Application of a processing pin to a gemstone which is to be cut or polished

US8815039B2 · kind B2 · utility

Assignee

• Paul Wild OHG · DE

Inventors

• Markus Wild · Stammham, DE
• Stefan Koehler · Eppelheim, DE

Key dates

• Filing date: Dec 23, 2008
• Grant date: Aug 26, 2014
• Expiry date: Mar 4, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1153
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A next processing pin is applied as a follow-on pin to a stone, wherein the stone is held by a preceding pin and fixed to the stone by way of a first adhesive bonding location. The preceding pin is separated from the stone. The follow-on pin is fixed to the stone by way of a second adhesive bonding location spaced from the first adhesive bonding location. The follow-on pin frontally receives a fluid adhesive at a spacing from the stone and the spacing between the adhesive-coated front end and the stone is reduced until the adhesive front end contacts the stone. The adhesive is hardened at the contact location as the second adhesive bonding location and heat is transferred by way of the preceding pin to the first adhesive bonding location A force component is exerted on the preceding pin to release the pin from the stone and to hold the stone with the next pin.