Method for minimizing magnetically dead interfacial layer during COC process
US8815060B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2004 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Jan 27, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for applying a protective layer to an electronic device such as the ABS of a slider, magnetic head, etc. for reducing paramagnetic deadlayer thickness includes selecting an etching angle for minimizing formation of a paramagnetic deadlayer at an interface of an electronic device and an adhesive layer subsequently formed on the electronic device, etching a surface of an electronic device at the selected angle, the selected angle being less than about 75 degrees from an imaginary line extending perpendicular to the surface, forming an adhesive layer on the etched surface of the electronic device, and forming a protective layer on the adhesive layer. A magnetic head formed by the process is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.