Patent · US Active

Connecting and bonding adjacent layers with nanostructures

US8815332B2 · kind B2 · utility

0Cited by

23References

5Claims

0Family size

Assignee

Smoltek AB · SE

Inventors

Mohammad Shafiqul Kabir · Gothenburg, SE
Andrzej Brud · Alvesta, SE

Key dates

Filing date	Aug 9, 2012
Grant date	Aug 26, 2014
Priority date	—
Expiry date	Aug 9, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24174
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.