Structure and method for forming detailed channels for thin walled components using thermal spraying
US8815371B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2009 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Sep 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24744
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A coated substrate with a subsurface cooling channel having no corner disposed proximate a seam between the substrate and the coating. A method for forming such a structure, including forming a groove in a surface of a substrate, forming a preform having a cooperating portion and a protruding portion, inserting the cooperating portion of the preform into the groove, leaving the protruding portion of the preform protruding beyond the surface of the substrate, applying a layer of a coating material to the surface of the substrate and the protruding portion of the perform, and removing the preform, thereby creating a cooling channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.