Metal laminated substrate for use as an oxide superconducting wire material, and manufacturing method therefor
US8815777B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 8, 2010 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Apr 16, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.