Disk with an electrical connection element
US8816214B2 · kind B2 · utility
9Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2011 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Jul 27, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/016
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A pane with an electrical connection element is described, including a substrate made of glass with a first coefficient of thermal expansion, an electrically conductive structure with a layer thickness of 5 μm to 40 μm on a region of the substrate, a connection element with a second coefficient of thermal expansion, and a layer of a solder material that connects the connection element electrically to subregions of the electrically conductive structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.