Patent · US Active

Component having a micromechanical microphone pattern

US8816454B2 · kind B2 · utility

5Cited by

3References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jochen Zoellin · Memmingen, DE
Ricardo Ehrenpfordt · Gerlingen, DE
Juergen Graf · Stuttgart, DE
Christoph Schelling · Stuttgart, DE
Frederik Ante · Stuttgart, DE
Michael Curcic · Stuttgart, DE

Key dates

Filing date	Jul 10, 2013
Grant date	Aug 26, 2014
Priority date	—
Expiry date	Jul 10, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH04R19/016
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A microphone component has a micromechanical microphone pattern which is implemented in a layer construction on a semiconductor substrate and includes (i) an acoustically active diaphragm which at least partially spans a sound opening on the backside of the substrate, (ii) at least one movable electrode of a microphone capacitor system, and (iii) a stationary acoustically penetrable counterelement having through holes, which counterelement is situated in the layer construction over the diaphragm and functions as the carrier for at least one immovable electrode of the microphone capacitor system. The diaphragm is tied in to the semiconductor substrate in a middle area, and the diaphragm has a corrugated sheet metal type of corrugation, at least in regions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.