High power, low-passive intermodulation microwave termination
US8816792B2 · kind B2 · utility
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15Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 15, 2010 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | May 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/26
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A termination configured to absorb high microwave power while generating low levels of passive intermodulation interference. The termination includes a microwave cable having a first end and a second end providing an insertion loss from the first end to the second end, a heat-dispersive element in thermal contact with at least a portion of the microwave cable, a channel accommodating the microwave cable, and an input connector coupled to the proximal end of the microwave cable. Optionally, one or more plates having grooves to accommodate the microwave cable may be provided between the heat-dispersive elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.