Liquid cooling system for modular electronic systems
US8817473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2011 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Aug 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The cooling body is cooled by introducing a fluid therein via an input conduit. The hot fluid is received from the cooling body by an output conduit and is cooled for recycling. The housing of the electronic device includes a rearward gap that admits the cooling body into the housing of the electronic device. Preferably, further cooling is provided by forcing a gas to flow past the output conduit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.