Patent · US Active

Single-layer component package

US8817485B2 · kind B2 · utility

0Cited by

23References

22Claims

0Family size

Assignee

GE Embedded Electronics Oy · FI

Inventors

Risto Tuominen · Espoo, FI
Petteri Palm · Regensburg, DE

Key dates

Filing date	Oct 21, 2009
Grant date	Aug 26, 2014
Priority date	—
Expiry date	May 19, 2030

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49169
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A single-layer component package comprising: a single conductive-pattern layer having a first surface; an insulating-material layer on the first surface of the single conductive-pattern layer; in an installation cavity inside the insulating-material layer, a semiconductor component having flat contact zones; and solid contact pillars containing copper and solderlessly, metallurgically and electrically connecting the flat contact zones to the single conductive-pattern layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.