Noise cancellation for a magnetically coupled communication link utilizing a lead frame
US8818296B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2012 |
| Grant date | Aug 26, 2014 |
| Priority date | — |
| Expiry date | Nov 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package includes an encapsulation and lead frame with a portion of the lead frame disposed within the encapsulation. The lead frame includes a first conductor formed in the lead frame having a first conductive loop and a third conductive loop disposed substantially within the encapsulation. A second conductor is formed in the lead frame galvanically isolated from the first conductor. The second conductor includes a second conductive loop disposed substantially within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors. The third conductive loop is wound in an opposite direction relative to the first conductive loop in the encapsulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.