Patent · US Active

Manufacturing method for a dual interface card

US8819918B2 · kind B2 · utility

3Cited by

12References

11Claims

0Family size

Assignee

ASSA ABLOY AB · SE

Inventors

Stephane Ayala · Marseille, FR
Lionel Carre · Seeg, DE
Jari-Pascal Curty · Nyon, CH

Key dates

Filing date	Aug 19, 2008
Grant date	Sep 2, 2014
Priority date	—
Expiry date	Jun 18, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49124
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a chip card, such as a dual interface card, is provided. The method generally includes collocating multiple card support sheets one onto the other, depositing a conductive adhesive onto contact pads on at least one of the sheets, positioning a dual interface module in a recess established in at least one of the sheets, and executing a lamination step.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.