Method for improving the adhesion between silver surfaces and resin materials

US8819930B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Christian Wunderlich · Chemnitz, DE
• Robert Rüther · Hemmingen, DE
• Jürgen Barthelmes · Berlin, DE
• Sia-Wing Kok · Bukit Mertajam, MY
• Nadine Menzel · Berlin, DE

Key dates

• Filing date: Sep 10, 2009
• Grant date: Sep 2, 2014
• Expiry date: Mar 4, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49146
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode. In a particular embodiment of this method, the present invention provides a method for producing a surface mounted electronic device comprising the following steps: (i) providing a lead frame having copper and silver surfaces, (ii) electrolytically treating the silver surfaces of the lead frame with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the lead frame is the cathode, (iii) encapsulating an electronic device together with the lead frame using a resin material.