Microfluidic device having improved epoxy layer adhesion
US8820883B2 · kind B2 · utility
7Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2011 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Dec 1, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/162
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A microfluidic device includes a substrate; at least one inorganic layer provided on the substrate; a patterned epoxy layer formed over the at least one inorganic layer, the patterned epoxy layer including a wall that defines a location for a fluid in the microfluidic device; and an alkoxysilane material containing a primary or secondary amine for promoting adhesion between the at least one inorganic layer and the patterned epoxy layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.