Mold for manufacturing an I/O port of a computer front panel
US8821146B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 29, 2012 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Jan 8, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/376
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold includes a mold core, a first cover, and a second cover. The mold core includes a cavity and a pair of elastic pieces. The pair of elastic pieces is in the cavity and divides the cavity into a first room and a second room. The first cover covers the first room of the cavity. The first cover defines a plurality of first plug holes. A first I/O can be formed in the first room by injecting a first liquid plastic material in the first room via the plurality of first plug holes. The second cover covers the first room and second room of the cavity. The second cover defines a plurality of second plug holes. A second I/O port assembly can be formed by injecting a second liquid plastic material in the first room and the second room via the plurality of second plug holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.