Bimetal laminate structure and method of making the same
US8821679B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2008 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | May 25, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24967
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a bimetal laminate structure and improved method for manufacturing the same. The method includes: applying a layer of adhesive to a metallic substrate; and laminating a decorative metallic sheet to the metallic substrate in such a manner that substantially all surface defects and all read through appearance along an outer surface of the decorative metallic sheet are eliminated. The resultant bimetal laminate includes a decorative metallic layer consisting of a first metallic material, and a metallic substrate consisting of a second metallic material that is different from the first metallic material. The metal substrate has a thickness that is greater than the thickness of the decorative metallic layer. An adhesive layer is disposed between, and spans substantially the entirety of the decorative metallic layer and metallic substrate to rigidly attach the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.