Method of molding a microneedle
US8821779B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2012 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Jul 16, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/756
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of molding a microneedle including providing a mold apparatus having a mold insert having the negative image of at least one microneedle, a compression core, a mold housing configured to allow a reciprocal motion between the mold insert and the compression core. The method includes placing the mold apparatus in a closed position, injecting polymeric material into the closed mold apparatus, compressing the injected polymeric material between the mold insert and the compression core by a reciprocal motion between the compression core and the mold insert, opening the mold, and removing a molded microneedle from the mold. The mold insert has a mold insert height and the molded microneedle has a height that is from about 90% of the mold insert height to about 115% of the mold insert height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.