Component having an overlapping laser track; method for producing such a component
US8822003B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2010 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Oct 3, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/15
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A component having a laser track as a fracture initiation line, said laser track being composed of laser holes formed by a laser beam for preparing for a later separation of the component into individual components. In order to ensure that, upon separation, the fracture always extends along the laser track, fractures deviating from the laser track are avoided, and the fracture edges after fracture are formed evenly and do not have jagged edges, it is proposed that the distance between two adjacent laser holes be less than or equal to the diameter of said laser holes, in each case measured on the surface of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.