Semiconductor device and method of manufacturing the same
US8822269B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2013 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Oct 2, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/029
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.