Curable resin composition, hardened material thereof, and optical semiconductor apparatus
US8822593B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2013 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Jun 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition to which at least phosphor particles and nanoparticles having a primary particle size of 1 nm or more and less than 100 nm are added, wherein the nanoparticles are dispersed in the form of secondarily aggregated particles having an average particle size of 100 nm or more and 20 μm or less in terms of volume Q3 is provided for an optical semiconductor apparatus in which when a sealant obtained by dispersing phosphor particles in a curable resin composition having a low viscosity is filled into a package substrate, the dispersion state of the phosphor particles is not changed at the early and late stages of the fabrication, specifically the amounts of the phosphor particles to be contained at the early and late stages are the same, and the color rendering property can be stably maintained, a hardened material thereof, and an optical semiconductor apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.