Semiconductor package and method for fabricating the same
US8823172B2 · kind B2 · utility
2Cited by
2References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 7, 2014 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Feb 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor chip having a first bump group and a second bump group, and a package substrate having a first pattern for data communication with the semiconductor chip and a second pattern for supplying power to the semiconductor chip or grounding the semiconductor chip, wherein the first bump group is disposed on the first pattern and the second bump group is disposed on the second pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.