Patent · US Active

Solder material for fastening an outer electrode on a piezoelectric component and piezoelectric component comprising a solder material

US8823245B2 · kind B2 · utility

1Cited by

9References

20Claims

0Family size

Assignee

EPCOS AG · DE

Inventors

Franz Rinner · Wolfsberg, AT
Markus Weiglhofer · Werndorf, AT
Marion Ottlinger · Wolfsberg, AT
Reinhard Gabl · St. Peter, AT
Martin Galler · Graz, AT
Christoph Auer · Graz, AT
Georg Kuegerl · Eibiswald, AT

Key dates

Filing date	Nov 22, 2010
Grant date	Sep 2, 2014
Priority date	—
Expiry date	Feb 23, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2101/36
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A solder material can be used for fastening an outer electrode on a piezoelectric component. The solder material contains tin as the main constituent and at least one addition from the group of cobalt, tungsten, osmium, titanium, vanadium, iron and rare earth metals. A piezoelectric component includes such a solder material. The solder material is applied by means of a base metallization.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.