Rapid optical assembly via simultaneous passive bonding

US8824068B2 · kind B2 · utility

Assignee

• BAE Systems Information and Electronic Systems Integration Inc. · US

Inventors

• Chris L. Willis · Hollis, US
• John C. McCarthy · Compton, US
• Katherine J. Snell · Nashua, US

Key dates

• Filing date: Apr 11, 2012
• Grant date: Sep 2, 2014
• Expiry date: Apr 14, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49947
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Techniques are disclosed for fabricating optical instrumentation. The techniques can be used, for instance, to populate an optical bench with several optics that can be simultaneously bonded and simultaneously verified to precise assembly, and without the use of adjustable mounts or active alignment. The techniques may be embodied, for instance, in a jig designed for operatively coupling to a given optical bench. The jig includes cut-outs that identify placement locations for the various optical components on the underlying optical bench. Thus, once the jig is secured to the optical bench, precise placement of the optical components is simplified. In some such embodiments, the jig further includes a clamping assembly for each cut-out, so that once an optical component is placed on the optical bench via that cutout, the clamping assembly can be engaged to hold that optical component in place while a deposited bonding agent is cured.