RF layered module using three dimensional vertical wiring and disposing method thereof
US8824163B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2011 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Apr 4, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.