Acoustic substrate
US8824707B2 · kind B2 · utility
6Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2011 |
| Grant date | Sep 2, 2014 |
| Priority date | — |
| Expiry date | Aug 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micromachined microphone or speaker embedded within, or positioned on top of, a substrate suitable for carrying microelectronic chips and components. The acoustic element converts sound energy into electrical energy which is then amplified by electronic components positioned on the surface of the substrate. Alternatively, the acoustic element may be driven by electronics to produce sound. The substrate can be used in standard microelectronic packaging applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.