Method of manufacturing a plurality of optical devices
US8828174B2 · kind B2 · utility
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18Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 17, 2009 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | May 18, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1062
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method wherein firstly a spacer arrangement and a first wafer are brought together with each other with a first portion of curable adhesive between a first side of the spacer arrangement and the first substrate, to produce a partial stack, and then a second wafer is brought together with a second side of the spacer arrangement, with a second portion of curable adhesive between the second side of the spacer arrangement and the second wafer. Then, the first portion of the curable adhesive and the second portion of the curable adhesive are cured simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.