Imprint method, chip production process, and imprint apparatus
US8828307B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2008 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Mar 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0047
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An imprint method includes contacting an imprint pattern of a mold and a resin material on a substrate. The resin material is cured by irradiating the resin material with light in a state in which the imprint pattern is in contact with the resin material. The mold is parted from the cured resin material, and gaseous molecules are irradiated, in an atmosphere in which the mold is placed, with an electromagnetic wave having a wavelength that is shorter than a wavelength of the light irradiating the resin material. The electromagnetic wave is emitted from an electrification removing light source that is provided in a lateral side of the mold. In the irradiating step, the gaseous molecules are ionized by the irradiation of the electromagnetic wave from the electrification removing light source. The ionized gaseous molecules are supplied into an atmosphere between the substrate and the mold to remove electrification of at least a portion of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.