Thick doped adhesive tape to enhance backscatter X-ray detectability
US8828538B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2012 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Dec 20, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Doped adhesive tape is used during the manufacture of aircraft, including positioning marks, covering orifices from debris, allowing locations to be marked. Any doped adhesive tape inadvertently left in sub-assemblies during the manufacturing process can be detected using backscatter X-ray inspection technology. Detection is facilitated in one embodiment by making the tape thicker, to produce an increased mass density, and in another embodiment by adding a dopant comprising an element that is readily detected by the backscatter X-ray technology. The element can be iodine, and can be incorporated into the backing layer or the adhesive layer of the tape during manufacturing. The use of both thicker tape and a dopant can be used in combination to facilitate detection. If the doped adhesive tape is detected after components are assembled using a backscatter X-ray inspection device, then the doped adhesive tape is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.