Conductive particles comprising complex metal layer with density gradient, method for preparing the particles, and anisotropic conductive adhesive composition comprising the particles
US8828543B2 · kind B2 · utility
0Cited by
11References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2007 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Dec 27, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.