Method for manufacturing LED

US8828754B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• Chieh Chang · Cedar Park, US
• HSING-FEN LO · Hsinchu, TW

Key dates

• Filing date: Apr 17, 2013
• Grant date: Sep 9, 2014
• Expiry date: Apr 17, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0361

Abstract

A method for manufacturing an LED includes steps: providing a base and an LED chip disposed on the base; providing an optical element and disposing the optical element on the base to cover the LED chip; providing a phosphor film and disposing the phosphor film on the optical element; providing a holding plate with capillary holes and disposing the base on the holding plate; providing a mold, wherein the mold and the holding plate cooperatively form a receiving room which receives the base, the LED chip, the optical element and the phosphor film therein; extracting air from the receiving room through the capillary holes of the holding plate, and/or, blowing air toward the phosphor film, whereby the phosphor film is conformably attached onto the optical element; and solidifying the phosphor film on the optical element.