Method for producing a light-emitting diode
US8828768B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2010 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Oct 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02639
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for producing a light-emitting diode. A carrier substrate has a silicon surface. A series of layers is deposited on the silicon surface in a direction of growth and a light-emitting diode structure is deposited on the series of layers. The series of layers includes a GaN layer, which is formed with gallium nitride. The series of layers includes a masking layer, which is formed with silicon nitride. The masking layer follows at least part of the GaN layer in the direction of growth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.