Process for assembling two parts of a circuit
US8828797B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2011 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | May 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional integrated structure is fabricated by assembling at least two parts together, wherein each part contains at least one metallic line covered with a covering region and having a free side. A cavity is formed in the covering region of each part, that cavity opening onto the metallic line. The two parts are joined together with the free sides facing each other and the cavities in each covering region aligned with each other. The metallic lines are then electrically joined to each other through an electromigration of the metal within at least one of the metallic lines, the electromigrated material filling the aligned cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.