Organic component and method for the production thereof

US8829496B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Marc Philippens · Regensburg, DE
• Tilman Schlenker · Nittendorf, DE

Key dates

• Filing date: Jul 8, 2010
• Grant date: Sep 9, 2014
• Expiry date: Aug 18, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K71/40

Abstract

A device comprising: a first substrate (1); a second substrate; at least one optoelectronic component (4) containing at least one organic material is arranged on the first substrate; the first substrate (1) and the second substrate (2) being arranged relative to one another in such a way that the optoelectronic component (4) is arranged between the first substrate (1) and the second substrate; a bonding material (3) is arranged between the first substrate (1) and the second substrate (2), said bonding material enclosing the optoelectronic component (4) in a frame type fashion and mechanically connecting the first and second substrates (1, 2) to one another; and wherein the bonding material (3) was softened by an exothermic chemical process of a reactive material (7) for mechanically connecting the substrates (1, 2).