Integrated circuit package
US8829684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2013 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Nov 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive backside. Conductive pathways extend between the front and back sides of the integrated circuit. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive pathways and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.