Systems and methods for heat extraction in a power supply
US8830680B2 · kind B2 · utility
1Cited by
10References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2012 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Mar 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Power supply and heat sink modules are suitable for use in sealed outdoor enclosures. Circuit elements in the power supply modules are connected to multiple heat sinks. The heat sinks are combined in heat sink modules. The heat sink modules provide high thermal conductivity while avoiding electromagnetic interference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.