Bundled mobile/desktop application package
US8832681B1 · kind B1 · utility
23Cited by
13References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 29, 2008 |
| Grant date | Sep 9, 2014 |
| Priority date | — |
| Expiry date | Dec 6, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F8/61
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure includes, among other things, a method for distributing a software program included within a bundled software application package installed on a first computing device to a second computing device which is in communication with the first computing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.